A research team led by Professor Taesung Kim from the School of Mechanical Engineering at Sungkyunkwan University has developed a technology that precisely controls the internal structure of semiconductors using heat, much like stamping out “bungeoppang” (fish-shaped pastry) in a mold. The team report that this approach improves the performance of next-generation artificial intelligence (AI) hardware. With this technology, complex AI computations can be processed more quickly using significantly less electricity than before. The findings are published in the journal ACS Nano.
Researchers pioneer next-generation AI semiconductors with ‘thermal constraining’ technique
-
HighlightsFree Dark Web Monitoring Stamps the $17 Million Credentials Markets
-
HighlightsSmart buildings: What happens to our free will when tech makes choices for us?
-
AppsScreenshots have generated new forms of storytelling, from Twitter fan fiction to desktop film
-
HighlightsDarknet markets generate millions in revenue selling stolen personal data, supply chain study finds
-
SecurityPrivacy violations undermine the trustworthiness of the Tim Hortons brand
-
Featured HeadlinesWhy Tesla’s Autopilot crashes spurred the feds to investigate driver-assist technologies – and what that means for the future of self-driving cars
